
Custom Electronics Services
Using its varied skills and resources, HVT is able to provide unique services for electronics manufacturers throughout a product life cycle. For example, HVT provides product testing and engineering, contract assembly (quick-turn prototypes and small run manufacturing), and fulfills ECNs and rework implementation for electronic components. Some examples are highlighted below. All custom services are performed to the same high quality standards as our core services.
If you have an electronics problem that needs to be solved, tell us about it at inquire@hvtnet.com or phone 770-495-4881. Most likely, we can help.
Assembly or Production Problems
E-Field Generator AssemblyCase Study
PROBLEM: Customer needed quick turn on e-field generator assembly.
SOLUTION: HVT used RAD techniques and sophisticated equipment to perform the final assembly of this high-tech product on tight schedule. Ten flex circuits were bonded to the e-field generator glass and PCBs, using HVT's semi-automatic Shibaura TTR-100 rack and bond transfer system, TTR-200 automatic anisotropic condictive film application system, and customer fixtures for flex-to-PCB bonding.
- Glass pitch: 100 micron
- Glass bond resistance: <5 ohms
- PCB bond resistance: <1 ohm
- 90-degree peel test: >800 grams
- 0-degree pull test: >4400 grams
Stereoscopic Shutter AssemblyCase Study
PROBLEM: Customer needed a qualified quick turn facility with equipment and expertise to perform stereoscopic shutter assembly.
SOLUTION: HVT provided integral services to the final assembly of this high-tech product. Sixteen heat seals were bonded to a 21" 3D stereoscopic viewer shutter and 8 PCB assemblies, using HVT's semi-automatic Shibaura TTR-100 tack and bond transfer system and custom fixtures for heat seal-to-PCB bonding.
OLED Display AssemblyCase Study
PROBLEM: Customer needed a qualified outsourcing facility for quick turnaround of flex ACF bonding and assembly sevices for a 128 x 64 pixel OLED graphic display.
SOLUTION: HVT provided bonding of four flexible polymer interconnection circuits between the display cell and PCBs, using Shibaura TTR-100 tack and bond transfer system, TTR-200 automatic anisotropic conductive fiml application system, and custom fixtures for PCB bonding.
- Bond 1 Column flex to glass
- Bond 2 Column flex to PCB
- Bond 3 Row flex to glass
- Bond 4 Row flex to PCB
Pitch course 722 microns, find 138 microns
Peel and pull 5kg (gaugemax)
ECN Implementation
Occasionally, an engineering change notice (ECN) needs to be emplemented long after a product has been shipped. For example, a manufacturer may be required to add ferrite beads to conform to emissions requirements, or replace defective electrolytic capacitor.
Often, the manufacturer will send a team of rework technicians from the factorytypically located in China, Taiwan, Korea or Japanto a service depot and implement the ECN. Other times, they will ask a service provider such as HVT to perform the rework. In either case, HVT can work with the OEM or system integrator to provide the logistics support required.
In addition to the facilties, equipment and experienced personnel, HVT has a proprietary repair tracking system that can be used to develop field performance profiles for equipment. The system can predict whether ECN work will be required in the near future.
We've found that HVT's quality of work can be higher than the quality obtained from factory technicians, since the factory technicians lack field environment experience.
Rework Implementation
Similar to ECN implementation, rework implementation requires facilties, expertise and logistics support for the rework. Whether the rework is required by the OEM or the system integrator, HVT can deliver a customized solution.